Inside Electronics

The use of chiplets to create advanced systems-on-chip (SoCs) can deliver cost-effective solutions with better performance and lower power consumption, compared to monolithic chips. However, without proper standards and regulations, variations in chipsets could lead to incompatibility issues that can stifle development. Recently, Arm introduced the Chiplet System Architecture (CSA), providing a set of partitioning and connectivity ...

AI and data center growth are putting unprecedented pressure on memory infrastructure, and the industry is feeling the effects. In this episode of Inside Electronics, host Alix Palture speaks with Brian Watson, Marketing Manager for Customized Memory Solutions at Winbond, about the challenges created by the rapid shift toward HBM and DDR5, the ongoing shortage of DDR4, and why legacy memory technologies remain essential for many re...

With the advance of wide-bandgap power semiconductors in the marketplace, many are starting to feel that the time is getting short for silicon-based power electronics. However, the fundamental structure of the silicon power MOSFET remained largely unchanged, and there is still a window of opportunity to develop next-generation devices that can leverage the maturity and expertise of the silicon processing industry. 

One such company...

Enterprise and Data Center SSD Form Factors (EDSFF) include E1 and E3 that have supplanted the conventional M.2 and 2.5-in form factors like U.2 in high end servers. M.2 slots are often found on motherboards but server removable drives are now dominated by EDSFF that support the latest PCI Express-based NVMe interfaces that provide massive throughput. In this episode, Sebastien Jean, Chief Technology Officer at Phison Electronics, ...

For more than six decades, Cinch Connectivity Solutions has addressed the demanding requirements of applications such as space exploration, delivering reliable, cost-effective solutions by leveraging its global team of expert engineers, manufacturing, and sales support. Cinch Connectivity Solutions’ CIN::APSE provides high-reliability, high-performance solderless, high-density interconnects for board-to-board, flex-to-board, and co...

This episode of Inside Electronics explores how a “power renaissance” is reshaping electronic design, with capacitors playing a central role. Host Alix Paultre speaks with Eduardo Drehmer, VP of Product Marketing at TDK Electronics, about rising power demands from AI, data centers, and electric vehicles, and how this pushes efficiency, thermal management, and reliability to the forefront.

Alix and Eduardo explain how multilayer cer...

This episode of Inside Electronics features Alix Paultre, Editor at Large for Electronic Design, and Dr. Hugo Guzman, Product Marketing Manager-Integrated Circuits at Littelfuse. Alix and Hugo discuss how smart solid-state relays (SSRs) are reshaping residential, commercial, and industrial building automation.

As engineers pack more HVAC controls, access systems, smart thermostats, sensors, and wireless modules into existing infras...

Axelera’s artificial intelligence processing unit is akin to the neural processing units (NPU) and are designed to handle AI inferencing while using very little power. Their quad core Metis AIPUs delivers 214 TOPs at under 4 W. It is available as a chip as well as on boards like their M.2 module. The company's latest Europa delivers up to 629 TOPs and can handle even more streams. Alexis Crowell, General Manager of Americas & G...

In this episode of the Inside Electronics podcast, we explore how modern industrial automation relies on robust, well designed power supplies to keep demanding systems running reliably. Host Alix Paultre, Editor-at-Large of Electronic Design, speaks with Mike Swenson, Marketing Manager for TRACO North America, about why industrial environments are among the toughest places for electronics, from electrical noise and extreme temperat...

While at least a dozen companies offer excellent solutions to deliver the ultra-high currents required to power modern GPUs, Ferric developed a unique capability to integrate thin-film magnetic power inductors within their devices’ packages that eliminates the need for bulky external components. As a result, they can create chip-scale power converters that integrate interface, telemetry, feedback control, and powertrain circuitry.

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There are all kinds of virtual machines (VM) available and many are being employed in embedded applications. Platforms like the Java virtual machine (JVM) are used on servers and embedded applications with features like garbage collection. Unfortunately, these can have a lot of overhead making them less desirable for small, microcontroller-based systems. Rolf Segger, Founder of Segger Microcontroller Systems, talks about the compan...

IoT empowers intelligent machines to provide advanced functionality to society, but it isn’t easy to get there from here. Key aspects of development include the importance of creating tools that empower others, the role of the market ecosystems in driving adoption, and the challenges in the infrastructure needed to bring connected technologies to the market. We talk to Alistair Fulton, CEO of IoT Labs, about the future of the marke...