Inside Electronics

Recently, Nanusens has begun making nano-scale structures within the layers of a CMOS chip using standard processes in CMOS fabs. The resulting MEMS sensors and the required control circuitry form single-chip solutions that are significantly smaller than their current, multi-component counterparts. We sat down with Nanusens CEO Dr. Josep Montanyà Silvestre to talk about the industry, the company, ...

The IEEE Applied Power Electronics Conference (APEC) 2026 was held this year in San Antonio, Texas, bringing together people from around the world to learn from, network, and do business with one another. A world-class exhibition of the latest in power electronics solutions, there was also a host of other activities at APEC, well worth looking into.

This year, there were 5,452 registrations, a record, with an increase in exhibitor...

Physical AI is the latest term for robot and drones with a mix of AI allowing them to be smarter and more robust. The latest crop of physical AI devices include more sensors that feed more AI models to provide the robot with a better understanding of its environment. These sensors often include cameras and distance sensors like LiDAR and radar. In this episode, Yaniv Sulkes, Vice President of Physical AI at Hailo, talks about ...

This episode of Inside Electronics, sponsored by DigiKey and Wurth Elektronik, focuses on flyback power electronics and how they are applied across different power-supply designs, especially power over Ethernet and offline AC/DC systems.

Host Alix Paultre introduces the topic and guides the discussion, while Jared Birk, Technical Marketing Engineer with Wurth Elektronik, shares his technical perspective and practical design experie...

National Instruments (NI) was started 50 years ago by Dr. Truchard—known to many as "Dr. T"—along with Jeff Kodosky and Bill Nowlin.". NI recently became part of Emerson. He was joined by Ritu Favre, President, Test and Measurement Business Group, and Kevin Schultz (CTO) at this year’s NI Connect 2026 in Fort Worth, TX. In this episode of Inside Electronics, we talk wit...

This episode of Inside Electronics, sponsored by DigiKey and RECOM Power, focuses on next-generation power solutions and the tradeoffs between modular and discrete power designs. The episode also covers key topologies, and how engineers can optimize for cost, size, efficiency, and time to market.

Host Alix Paultre introduces the topic and interviews Steve Roberts, Innovation Manager at RECOM Power. The conversation covers why power...

The emergence of "Physical AI" requires a bridge between digital logic and the chaotic variables of the analog world. TDK's SensorGPT serves as this bridge by creating a feedback loop: synthetic data trains the initial model, and the limited real-world data subsequently gathered is used to refine the generative parameters. 

Hear more about SensorGPT applications, capabilities and about i...

This episode of Inside Electronics, sponsored by DigiKey and Hammond Manufacturing, is a conversation about modified enclosures and how they can better meet design needs. Host Alex Paultre interviews Allyn Weilacher, Marketing Operations Specialist at Hammond. The discussion centers on why enclosures matter as the “body” of an electronic project, protecting components from weather, EMI/RFI, and harsh environments.

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Consumer trust is a foundational element of any successful business, yet many companies don’t pay enough attention to tampering prevention in their products and systems. 

A single case of tampering can trigger recalls, lawsuits, and lost customers, and negative press spreads quickly. Once trust is broken, rebuilding it is very difficult and expensive. In this podcast, we talk to Chris Morrison, VP of ...

As demand for memory in AI servers continues to grow, suppliers are shifting focus. This is creating new challenges for the automotive industry. Longer lead times, tighter supply, and shifting product strategies are forcing automakers and suppliers to rethink how they plan and design systems, raising the risk of component shortages and costly redesigns.

In this episode of Inside Electronics, host Alix Palture sits do...

The use of chiplets to create advanced systems-on-chip (SoCs) can deliver cost-effective solutions with better performance and lower power consumption, compared to monolithic chips. However, without proper standards and regulations, variations in chipsets could lead to incompatibility issues that can stifle development. Recently, Arm introduced the Chiplet System Architecture (CSA), providing a set of partitioning and connecti...

AI and data center growth are putting unprecedented pressure on memory infrastructure, and the industry is feeling the effects. In this episode of Inside Electronics, host Alix Palture speaks with Brian Watson, Marketing Manager for Customized Memory Solutions at Winbond, about the challenges created by the rapid shift toward HBM and DDR5, the ongoing shortage of DDR4, and why legacy memory technologies remain essential for ma...

With the advance of wide-bandgap power semiconductors in the marketplace, many are starting to feel that the time is getting short for silicon-based power electronics. However, the fundamental structure of the silicon power MOSFET remained largely unchanged, and there is still a window of opportunity to develop next-generation devices that can leverage the maturity and expertise of the silicon processing in...

Enterprise and Data Center SSD Form Factors (EDSFF) include E1 and E3 that have supplanted the conventional M.2 and 2.5-in form factors like U.2 in high end servers. M.2 slots are often found on motherboards but server removable drives are now dominated by EDSFF that support the latest PCI Express-based NVMe interfaces that provide massive throughput. In this episode, Sebastien Jean, Chief Technology Office...

For more than six decades, Cinch Connectivity Solutions has addressed the demanding requirements of applications such as space exploration, delivering reliable, cost-effective solutions by leveraging its global team of expert engineers, manufacturing, and sales support. Cinch Connectivity Solutions’ CIN::APSE provides high-reliability, high-performance solderless, high-density interconnects for board-to-board, flex-...

This episode of Inside Electronics explores how a “power renaissance” is reshaping electronic design, with capacitors playing a central role. Host Alix Paultre speaks with Eduardo Drehmer, VP of Product Marketing at TDK Electronics, about rising power demands from AI, data centers, and electric vehicles, and how this pushes efficiency, thermal management, and reliability to the forefront.

Alix and Eduardo explain how mu...