Inside Electronics

This episode of Inside Electronics, sponsored by DigiKey and Wurth Elektronik, focuses on flyback power electronics and how they are applied across different power-supply designs, especially power over Ethernet and offline AC/DC systems.

Host Alix Paultre introduces the topic and guides the discussion, while Jared Birk, Technical Marketing Engineer with Wurth Elektronik, shares his technical perspective and practical design experie...

National Instruments (NI) was started 50 years ago by Dr. Truchard—known to many as "Dr. T"—along with Jeff Kodosky and Bill Nowlin.". NI recently became part of Emerson. He was joined by Ritu Favre, President, Test and Measurement Business Group, and Kevin Schultz (CTO) at this year’s NI Connect 2026 in Fort Worth, TX. In this episode of Inside Electronics, we talk with Ritu Favre about NI in general and about LabVIEW’s Nigel AI. 

This episode of Inside Electronics, sponsored by DigiKey and RECOM Power, focuses on next-generation power solutions and the tradeoffs between modular and discrete power designs. The episode also covers key topologies, and how engineers can optimize for cost, size, efficiency, and time to market.

Host Alix Paultre introduces the topic and interviews Steve Roberts, Innovation Manager at RECOM Power. The conversation covers why power...

The emergence of "Physical AI" requires a bridge between digital logic and the chaotic variables of the analog world. TDK's SensorGPT serves as this bridge by creating a feedback loop: synthetic data trains the initial model, and the limited real-world data subsequently gathered is used to refine the generative parameters. 

Hear more about SensorGPT applications, capabilities and about its limitations and availability as Electronic...

This episode of Inside Electronics, sponsored by DigiKey and Hammond Manufacturing, is a conversation about modified enclosures and how they can better meet design needs. Host Alex Paultre interviews Allyn Weilacher, Marketing Operations Specialist at Hammond. The discussion centers on why enclosures matter as the “body” of an electronic project, protecting components from weather, EMI/RFI, and harsh environments.

They also cover c...

Consumer trust is a foundational element of any successful business, yet many companies don’t pay enough attention to tampering prevention in their products and systems. 

A single case of tampering can trigger recalls, lawsuits, and lost customers, and negative press spreads quickly. Once trust is broken, rebuilding it is very difficult and expensive. In this podcast, we talk to Chris Morrison, VP of Product Marketing at Agile Anal...

As demand for memory in AI servers continues to grow, suppliers are shifting focus. This is creating new challenges for the automotive industry. Longer lead times, tighter supply, and shifting product strategies are forcing automakers and suppliers to rethink how they plan and design systems, raising the risk of component shortages and costly redesigns.

In this episode of Inside Electronics, host Alix Palture sits down with Jun Kaw...

The use of chiplets to create advanced systems-on-chip (SoCs) can deliver cost-effective solutions with better performance and lower power consumption, compared to monolithic chips. However, without proper standards and regulations, variations in chipsets could lead to incompatibility issues that can stifle development. Recently, Arm introduced the Chiplet System Architecture (CSA), providing a set of partitioning and connectivity ...

AI and data center growth are putting unprecedented pressure on memory infrastructure, and the industry is feeling the effects. In this episode of Inside Electronics, host Alix Palture speaks with Brian Watson, Marketing Manager for Customized Memory Solutions at Winbond, about the challenges created by the rapid shift toward HBM and DDR5, the ongoing shortage of DDR4, and why legacy memory technologies remain essential for many re...

With the advance of wide-bandgap power semiconductors in the marketplace, many are starting to feel that the time is getting short for silicon-based power electronics. However, the fundamental structure of the silicon power MOSFET remained largely unchanged, and there is still a window of opportunity to develop next-generation devices that can leverage the maturity and expertise of the silicon processing industry. 

One such company...

Enterprise and Data Center SSD Form Factors (EDSFF) include E1 and E3 that have supplanted the conventional M.2 and 2.5-in form factors like U.2 in high end servers. M.2 slots are often found on motherboards but server removable drives are now dominated by EDSFF that support the latest PCI Express-based NVMe interfaces that provide massive throughput. In this episode, Sebastien Jean, Chief Technology Officer at Phison Electronics, ...

For more than six decades, Cinch Connectivity Solutions has addressed the demanding requirements of applications such as space exploration, delivering reliable, cost-effective solutions by leveraging its global team of expert engineers, manufacturing, and sales support. Cinch Connectivity Solutions’ CIN::APSE provides high-reliability, high-performance solderless, high-density interconnects for board-to-board, flex-to-board, and co...

This episode of Inside Electronics explores how a “power renaissance” is reshaping electronic design, with capacitors playing a central role. Host Alix Paultre speaks with Eduardo Drehmer, VP of Product Marketing at TDK Electronics, about rising power demands from AI, data centers, and electric vehicles, and how this pushes efficiency, thermal management, and reliability to the forefront.

Alix and Eduardo explain how multilayer cer...

This episode of Inside Electronics features Alix Paultre, Editor at Large for Electronic Design, and Dr. Hugo Guzman, Product Marketing Manager-Integrated Circuits at Littelfuse. Alix and Hugo discuss how smart solid-state relays (SSRs) are reshaping residential, commercial, and industrial building automation.

As engineers pack more HVAC controls, access systems, smart thermostats, sensors, and wireless modules into existing infras...

Axelera’s artificial intelligence processing unit is akin to the neural processing units (NPU) and are designed to handle AI inferencing while using very little power. Their quad core Metis AIPUs delivers 214 TOPs at under 4 W. It is available as a chip as well as on boards like their M.2 module. The company's latest Europa delivers up to 629 TOPs and can handle even more streams. Alexis Crowell, General Manager of Americas & G...